High frequency hybrid PCB boards are pressed with different laminated materials to optimize electrical performance and improve system reliability. The biggest challenge in manufacturing such high frequency hybrid PCB board is to match the coefficient of thermal expansion (CTE) of different materials for hybrid PCB boards PCB fabrication and component assembly.
Typically, such hybrid PCB boards designs include a combination of FR-4 materials and teflon laminates. All well-known hybrid PCB manufacturers, such as Isola, Rogers, Arlon and Taconic, have published key technical parameters regarding the performance of their laminates.
The high frequency hybrid PCB boards with induction heating technology has been widely used in communication industry, network technology and high-speed information processing system, which meets the requirements of many high-precision parameter instruments.
Multilayer mixed lamination PCB board needs to use materials with different characteristics than traditional multilayer PCB board. Hybrid PCB can be a mixture of FR4 and hf PCBs, or a mixture of HF PCBs from different DKS. With technological innovation, hybrid PCB structures are becoming more and more popular. This brings benefits, but the challenges also need to be better understood.
There are three main reasons for using a hybrid PCB: cost, improved reliability and enhanced electrical performance. Hf line materials are much more expensive than FR4. Sometimes, using hybrid PCB of FR4 and hf lines can solve the cost problem. In many cases, some lines of hybrid PCB board require high electrical performance, and some do not. In this case, FR4 is used for the less electrically demanding part, while the more expensive high frequency material is used for the more electrically demanding part.
Another reason to use hybrid PCB board is to improve reliability when using PCB materials with high CTE values. Some high-frequency PTFE materials have high CTE properties, which can cause reliability problems. Composite CTE is acceptable when a low CTE FR4 material is combined with a high CTE material to make a multilayer PCB.
1. High frequency hybrid PCB with small dielectric constant, loss will be very small, and advanced induction heating technology can achieve the needs of the target heating, very high efficiency. Of course, while paying attention to efficiency, it also has the characteristics of environmental protection, which is very suitable for the development direction of today's society.
2. The transmission speed is inversely proportional to the square root of the dielectric constant, meaning that the smaller the dielectric constant, the faster the transmission speed. This is the advantage of high frequency hybrid PCB, it uses special material, not only to ensure the characteristics of small dielectric constant, but also to maintain the stability of the operation, for signal transmission is very important.
3. Widely used in various industries for precision metal material heat treatment requirements of high frequency hybrid PCB, in the field of the process, not only can realize the depth of different parts of heat, but also according to the characteristics of the local key heating, both the surface and deep, centralized or decentralized heating mode, and can be easily accomplished.
4. Dielectric constant and medium, there will be certain requirements for the environment, especially in the south, wet weather will seriously affect the use of PCBs. High frequency hybrid PCB boards made of extremely low water absorption materials can challenge such environments, but also have the advantages of chemical corrosion resistance, moisture resistance, high temperature resistance and great peel strength, so that high frequency hybrid PCB boards play a powerful performance.