Lamination Structure And Difficulty Of Mixed Lamination PCB

Experience in laminated material physics and equipment performance is critical when using different materials to manufacture hybrid PCB boards.  At high temperatures (such as in the press of the laminating process), each material shrinks/expands at a different rate due to the different thermal expansion coefficient CTE values of the material layers (such as FR4, PTFE and copper foil).   When one hybrid PCB material contracts and another expands, mismatch problems between different layers can result, such as delamination between copper foil and substrate interface, between FR4 and PTFE and semi-cured sheet.      Therefore, not all materials can be used in hybrid PCB pressure plates.

Communicate with Huihe Circuits early in the design process, and Huihe Circuits will give you satisfactory results because Huihe Circuits know best what materials are most easily matched. For example, the hybrid PCB Rogers 5880 is an rf material that can be used in highly reliable products. But the biggest drawback of this material is that it will shrink after etching the copper, so hybrid PCB manufacturers need to know how to circumvent this problem in the process.

One of the major challenges for RF/microwave applications is how to ensure that the actual tolerances are within the design tolerances to achieve the desired operating frequency.  In the hybrid PCB design of mixed pressure structure, one of the biggest challenges is that the thickness of different panels and even different pieces should be uniform.     Due to the existence of a variety of substrate material types, there are also a variety of semi-cured sheet types.

Many RF design rf signal layers have large non-copper filled areas after etching, and hybrid PCB manufacturers will use different techniques to ensure adequate insulation between the different conductive layers and to ensure consistent thickness.

In general, non-adhesive FR-4 semi-cured sheets are the best solution for uniform plate thickness, but they can change the electrical performance of the entire package.   Not all hybrid PCB manufacturers have identical manufacturing processes, but they differ, so hybrid PCB manufacturers' involvement in circuit design projects early in the design process is critical to ensuring the success of the project.