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High Frequency PCB Process Capabilities


Items

Process Capabilities

Layers

1-10

Base materals

FR-4, High-frequency

Maximum size

450mm×600mm

Dimension accuracy

±0.10mm

Thickness range

0.40-5.00mm

Thickness tolerance(THK≥0.8mm)

±10%

Thickness tolerance(THK<0.8mm)

±10%

Dielectric thickness

0.07-1.50mm

Minimum line width

0.1mm

Minimum space

0.1mm

Outer copper thickness

35-105um

Inner copper thickness

17-75um

Drill hole(Mechanical)

0.2-6.35mm

Finished hole(Mechanical)

0.15-6.30mm

Diameter tolerance(Mechanical)

±0.075mm

Hole position tolerance(Mechanical)

±0.05mm

Aspect ratio

10:01

Solder mask type

LPI

Minimum solder mask bridge width

0.1mm

Minimum solder mask clearance

0.075mm

Plug hole diameter

0.20-0.50mm

Impedance control tolerance

±10%

Surface finish

HASL, LF-HASL, ENIG, Imm Tin, Imm Ag, OSP, Gold Finger

Base Materials For High Frequency PCB



Rogers

Taconic

F4B

Shengyi

Mixed laminated PCB

Pure laminated PCB

RO3003

TLY-5

F4BM220

S7136

RO4350B+FR4

RO4350B+RO4450F+RO4350B

RO3010

TLX-6

F4BM255


RO4003C+FR4

RO4003C+RO4450F+RO4003C

RO4003C

TLX-8

F4BM265


RF-35+FR4

F4BME+RO4450F+F4BME

RO4350B

RF-35

F4BM300


TLX-8+FR4


RO5880


F4BM350


F4BME+FR4



High Frequency PCB Materials Parameters


Materials

Tg/℃

CTE-z(T<Tg)ppm/℃

εr@10GHz

KV/mm

W/㎡K

Dk@10GHz

Td/℃

N/mm

RO4350

280°

32

3.48

31

5.7×10^9

0.69

0.0037

390°

0.9

ISOLA

220°

55

4.45

-

2.8×10^6


0.0087

-

1.2

Taconic 

RF-35

315°

64

3.50

-

1.5×10^8

0.24

0.0018

-

1.8

Taconic 

TLX PTFE

-

135

2.50

-

1×10^7

0.90

0.0019

-

2.1

Taconic 

TLC PTFE

-

70

3.20

-

1×10^7

0.24

-

-

2.1

RO3001 

PTFE

160°

-

2.28

98

1×10^9

0.22

0.0030

-

2.1

RO3003 

PTFE

-

25

3.00

-

1×10^7

0.50

0.0013

500°

2.2

RO3006 

PTFE

-

24

6.15

-

1×10^5

0.79

0.0020

500°

1.2

RO3010 

PTFE

-

16

10.2

-

1×10^5

0.96

0.0022

500°

1.6

ARLON 

85N 

High Tg

250°

55

4.20

57

1.6×10^9

0.20

0.0100

387°

1.2

Production Time

Layers

Process Time

2 Layer High Frequency PCB

+3 days

Multilayer High Frequency PCB

+5 days

Blind Via High Frequency PCB

+6 days